TY - GEN
T1 - Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
AU - Chan, Y. Sing
AU - Song, Fubin
AU - Lee, S. W.Ricky
PY - 2011
Y1 - 2011
N2 - The use of edge-bond adhesive is recently found to be a possible alternative to underfill for solder joint protection. This paper investigates the effectiveness of using it for the enhancement of solder joint thermal fatigue reliability. Both the accelerated temperature cycling (ATC) test and simulation are performed for the study. The test vehicle is a 51×51 mm ceramic ball grid array (CBGA) package. There are three batches of samples prepared. One of them utilizes no edge-bond and the other two adopt different edge-bond adhesives. Opposite results, surprisingly, are obtained from the two edge-bonded cases. It is observed that the use of edge-bond can either enhance or degrade the solder joint reliability. The simulation results agree with those from the experiments. This suggests that there are controlling factors for the phenomenon observed. Through an analytical consideration, it is identified that these factors are indeed tied with the mechanical properties of the edge-bond adhesives. The coefficient of thermal expansion (CTE) and the Young's modulus are namely the properties in concern. In order to enhance the thermal fatigue reliability of solder joints, edge-bond with large modulus and CTE close to that of the solder joints should be employed.
AB - The use of edge-bond adhesive is recently found to be a possible alternative to underfill for solder joint protection. This paper investigates the effectiveness of using it for the enhancement of solder joint thermal fatigue reliability. Both the accelerated temperature cycling (ATC) test and simulation are performed for the study. The test vehicle is a 51×51 mm ceramic ball grid array (CBGA) package. There are three batches of samples prepared. One of them utilizes no edge-bond and the other two adopt different edge-bond adhesives. Opposite results, surprisingly, are obtained from the two edge-bonded cases. It is observed that the use of edge-bond can either enhance or degrade the solder joint reliability. The simulation results agree with those from the experiments. This suggests that there are controlling factors for the phenomenon observed. Through an analytical consideration, it is identified that these factors are indeed tied with the mechanical properties of the edge-bond adhesives. The coefficient of thermal expansion (CTE) and the Young's modulus are namely the properties in concern. In order to enhance the thermal fatigue reliability of solder joints, edge-bond with large modulus and CTE close to that of the solder joints should be employed.
UR - https://openalex.org/W2084413889
UR - https://www.scopus.com/pages/publications/81355123809
U2 - 10.1109/ICEPT.2011.6066885
DO - 10.1109/ICEPT.2011.6066885
M3 - Conference Paper published in a book
SN - 9781457717680
T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
SP - 500
EP - 505
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Y2 - 8 August 2011 through 11 August 2011
ER -