Large-Scale Electromagnetic Structure for Ambient RF Energy Harvesting

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Abstract

This research explores the integration of the Internet of Things (IoT) within a large-scale electromagnetic (EM) structure powered by innovative ambient radio frequency (RF) energy harvesting. The proposed planar Yagi antenna, designed for the GSM-900 frequency range, serves as a foundational element. Simulations reveal its efficiency, achieving a maximum gain of 5.9 dBi within the 930 to 980 MHz band. Building upon this, an 8×4 array of 32 planar Yagi antennas is devised to increase signal strength, aiming for approximately 20 dB gain. A phased-array approach with 60-degree phase shifts enhances adaptability, allowing beam tilting away from the wall. Simulations confirm a 34-degree tilt, validating the array's performance. The large-scale EM structure, with its array configuration and beamforming capabilities, presents significant promise for applications requiring heightened signal strength and adaptability. Prototyping for IoT sensor systems is underway, marking a step toward interconnected, sustainable, and intelligent environments.

Original languageEnglish
Title of host publication2024 IEEE International Symposium on Antennas and Propagation and INC/USNCURSI Radio Science Meeting, AP-S/INC-USNC-URSI 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2597-2598
Number of pages2
ISBN (Electronic)9798350369908
DOIs
Publication statusPublished - 2024
Event2024 IEEE International Symposium on Antennas and Propagation and INC/USNCURSI Radio Science Meeting, AP-S/INC-USNC-URSI 2024 - Florence, Italy
Duration: 14 Jul 202419 Jul 2024

Publication series

NameIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
ISSN (Print)1522-3965

Conference

Conference2024 IEEE International Symposium on Antennas and Propagation and INC/USNCURSI Radio Science Meeting, AP-S/INC-USNC-URSI 2024
Country/TerritoryItaly
CityFlorence
Period14/07/2419/07/24

Bibliographical note

Publisher Copyright:
© 2024 IEEE.

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