Low temperature floating plasma oxidation of poly-SiGe

Z. Fan*, G. Zhao, P. K. Chu, Z. Jin, H. Kwok, M. Wong

*Corresponding author for this work

Research output: Contribution to journalConference article published in journalpeer-review

Abstract

Low temperature oxidation is an essential process for thin-film transistors (TFT) used in active-matrix liquid crystal displays (AMLCD). However, low temperature oxidation gives rise to defects at SiO2/poly-SiGe interfaces. We have recently developed a novel plasma oxidation method for poly-SiGe materials. The poly-SiGe wafers are soaked in 0.1 Torr pure oxygen RF (Radio Frequency) plasma and isolated. That is, the sample voltage is the same as the sheath potential of the floating wall, which is always negative since electrons move faster than ions. The defects caused by ion impact can therefore be reduced. No heating is applied during oxidation, as the sample is heated slightly by the plasma. Under our conditions, the temperature is below 100 °C even after oxidation for two hours. Depth profiles are acquired by AES and the oxide/substrate interface is examined by XPS. NMOS devices fabricated using this gate oxide show good characteristics.

Original languageEnglish
Pages (from-to)157-160
Number of pages4
JournalMaterials Research Society Symposium - Proceedings
Volume508
DOIs
Publication statusPublished - 1998
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: 13 Apr 199815 Apr 1998

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