Abstract
One method for CTE measurement and two methods for warpage measurement of plastic ball grid array (PBGA) package materials and structures are presented in this paper. In all these measurements, a special oven and a fixture were designed. To measure the CTE value, an optical displacement follower was employed. The CTE values for a plain BT and a complete BT substrate ready for die attachment was found to differ by 8%. On the other hand, in the warpage measurement the laser scanning method was described first. Its has the advantage of measuring the absolute warpage value of a package but the measurement duration was much longer than the second method, namely the ESPI method. The effects of the heating-up rate and the Tg value of the molding compound were found to significantly affect the warpage values.
| Original language | English |
|---|---|
| Pages (from-to) | 1216-1226 |
| Number of pages | 11 |
| Journal | National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East) |
| Volume | 2 |
| Publication status | Published - 1999 |
| Externally published | Yes |
| Event | Proceedings of the NEPCON WEST '99 - Anaheim, CA, USA Duration: 21 Feb 1999 → 25 Feb 1999 |