@inproceedings{7ea700ed79954881bab9b84efea4ff1c,
title = "Mosaic diamond pad conditioners for improved CMP performance",
abstract = "A mosaic design of diamond disks that incorporates different cutting characteristics of diamond grits can allow faster polishing of wafers with less pad consumption. Larger diamond grits can make pad asperities with large peak to valley ratios for achieving high polishing rate. On the other hand, Sharp grits can shave the pad effectively as to eliminate the glazed layer. The conventional diamond disks employ similar type of diamond grits across the entire disk. These grits cannot dress and cut the pad with optimization. By combining different types of diamond grits in a cocktail combination, the pad asperities can be controlled to enhance removal rates of the wafer. The glazed layer may also be removed cleaner so wafer defectivity is minimized.",
author = "Sung, \{James C.\} and Tsai, \{Ming Yi\} and Pai, \{Yang Liang\} and Chou, \{Cheng Shiang\} and Chou, \{Chih Chung\} and Zongqing Yang and Chen, \{Ying Tung\} and Michael Sung",
year = "2010",
doi = "10.1149/1.3360677",
language = "English",
isbn = "9781607682639",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "1",
pages = "575--580",
booktitle = "China Semiconductor Technology International Conference 2010, CSTIC 2010",
edition = "1",
note = "China Semiconductor Technology International Conference 2010, CSTIC 2010 ; Conference date: 18-03-2010 Through 19-03-2010",
}