Abstract
The present work proposes a Dugdale type model to theoretically predict the multiple cracks of a residually tensile stressed thin film on a ductile substrate. The results show that there exists a critical value, Rc, of the cracking resistance number, R. When R < Rc, the film cracks and the normalized crack spacing is determined by cracking resistance number and the stress ratio of the residual stress to the yield strength of the substrate.
| Original language | English |
|---|---|
| Pages (from-to) | 391-396 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 695 |
| DOIs | |
| Publication status | Published - 2002 |
| Event | Thin Films: Stresses and Mechanical Properties IX - Boston, MA, United States Duration: 26 Nov 2001 → 30 Nov 2001 |
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