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Multiple cracks of a thin film on a ductile substrate

  • Ming Hao Zhao
  • , Ran Fu
  • , Tong Yi Zhang*
  • *Corresponding author for this work

Research output: Contribution to journalConference article published in journalpeer-review

Abstract

The present work proposes a Dugdale type model to theoretically predict the multiple cracks of a residually tensile stressed thin film on a ductile substrate. The results show that there exists a critical value, Rc, of the cracking resistance number, R. When R < Rc, the film cracks and the normalized crack spacing is determined by cracking resistance number and the stress ratio of the residual stress to the yield strength of the substrate.

Original languageEnglish
Pages (from-to)391-396
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume695
DOIs
Publication statusPublished - 2002
EventThin Films: Stresses and Mechanical Properties IX - Boston, MA, United States
Duration: 26 Nov 200130 Nov 2001

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