@inproceedings{1c6434afb5224bf6bfdcf6b0bd7cba1a,
title = "Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging",
abstract = "The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time. Copyright",
keywords = "Intermetallic compound, Lead-free solder, Nanoindentation, Thermal aging",
author = "Tong Jiang and Fubin Song and Chaoran Yang and \{Ricky Lee\}, \{S. W.\}",
year = "2010",
language = "English",
isbn = "9781617823206",
series = "43rd International Symposium on Microelectronics 2010, IMAPS 2010",
pages = "314--318",
booktitle = "43rd International Symposium on Microelectronics 2010, IMAPS 2010",
note = "43rd Annual IMAPS International Symposium on Microelectronics, IMAPS 2010 ; Conference date: 31-10-2010 Through 04-11-2010",
}