TY - GEN
T1 - Neural network based computer-aided process design system for wire bonding quality improvement
AU - Gao, Jian
AU - Li, Chuanwei
AU - Li, Ketian
AU - Li, Zexiang
AU - Chen, Xin
PY - 2010
Y1 - 2010
N2 - The relationship between the process parameters and bonding quality is very complicated due to the features of non-linear and coupling relation. It's therefore hard to express their relationship in an exact mathematic model and very difficult to obtain an reasonable parameters setting to get high bonding quality. In this paper, a wire bonding process model based on BP(Back Propagation) neural network is proposed, and based on this model a computer-aided process design system for bonding quality improvement is developed through VC++6.0. Based on the training data from design of experiments (DoE), the BP network is built. The system is validated by test data and the testing result shows that the predicted error is samll and reasonable and the system developed can be used for parameter optimization and quality improvement.
AB - The relationship between the process parameters and bonding quality is very complicated due to the features of non-linear and coupling relation. It's therefore hard to express their relationship in an exact mathematic model and very difficult to obtain an reasonable parameters setting to get high bonding quality. In this paper, a wire bonding process model based on BP(Back Propagation) neural network is proposed, and based on this model a computer-aided process design system for bonding quality improvement is developed through VC++6.0. Based on the training data from design of experiments (DoE), the BP network is built. The system is validated by test data and the testing result shows that the predicted error is samll and reasonable and the system developed can be used for parameter optimization and quality improvement.
KW - BP neural network
KW - Bonding quality
KW - Computer-aided process design
KW - Process parameters
KW - Wire bonding
UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000279864701153
UR - https://openalex.org/W2048580161
UR - https://www.scopus.com/pages/publications/77950975163
U2 - 10.4028/www.scientific.net/AMR.97-101.2496
DO - 10.4028/www.scientific.net/AMR.97-101.2496
M3 - Conference Paper published in a book
SN - 0878492801
SN - 9780878492800
T3 - Advanced Materials Research
SP - 2496
EP - 2499
BT - Manufacturing Science and Engineering I
T2 - 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009
Y2 - 26 December 2009 through 28 December 2009
ER -