TY - JOUR
T1 - Nitrided La 2O 3 as charge-trapping layer for nonvolatile memory applications
AU - Huang, X. D.
AU - Sin, Johnny K.O.
AU - Lai, P. T.
PY - 2012
Y1 - 2012
N2 - Charge-trapping characteristics of La 2O 3 with and without nitrogen incorporation were investigated based on Al/Al 2O 3/La 2O 3/SiO 2Si (MONOS) capacitors. The physical properties of the high-k films were analyzed by X-ray diffraction and X-ray photoelectron spectroscopy. Compared with the MONOS capacitor with La 2O 3 as charge-trapping layer, the one with nitrided La 2O 3 showed a larger memory window (4.9 V at ±10-V sweeping voltage), higher program speed (4.9 V at 1-ms +14 V), and smaller charge loss (27% after 10 years), due to the nitrided La 2O 3 film exhibiting less crystallized structure and high trap density induced by nitrogen incorporation, and suppressed leakage by nitrogen passivation.
AB - Charge-trapping characteristics of La 2O 3 with and without nitrogen incorporation were investigated based on Al/Al 2O 3/La 2O 3/SiO 2Si (MONOS) capacitors. The physical properties of the high-k films were analyzed by X-ray diffraction and X-ray photoelectron spectroscopy. Compared with the MONOS capacitor with La 2O 3 as charge-trapping layer, the one with nitrided La 2O 3 showed a larger memory window (4.9 V at ±10-V sweeping voltage), higher program speed (4.9 V at 1-ms +14 V), and smaller charge loss (27% after 10 years), due to the nitrided La 2O 3 film exhibiting less crystallized structure and high trap density induced by nitrogen incorporation, and suppressed leakage by nitrogen passivation.
KW - Charge-trapping layer (CTL)
KW - high-k dielectric
KW - metal-oxide-nitride-oxide- silicon (MONOS)
KW - nitrided La O
KW - nonvolatile memory
UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000305085100015
UR - https://openalex.org/W1972280907
UR - https://www.scopus.com/pages/publications/84862019150
U2 - 10.1109/TDMR.2011.2182197
DO - 10.1109/TDMR.2011.2182197
M3 - Journal Article
SN - 1530-4388
VL - 12
SP - 306
EP - 310
JO - IEEE Transactions on Device and Materials Reliability
JF - IEEE Transactions on Device and Materials Reliability
IS - 2
M1 - 6125241
ER -