Abstract
While low-temperature thin film transistor with metal-induced-laterally-crystallized (MILC) channels are better than their solid-phase-crystallized (SPC) counterparts in many device performance measures, they suffer from higher off-state leakage current and lower drain breakdown voltage because of the self-aligned metal-induction-crystallized (MIC) source and drain regions. A new technology that enables the removal of all major grain boundaries transverse to the drain current flow is presently proposed, resulting in devices with higher field-effect mobility and significantly reduced leakage current, as well as much improved spatial uniformity of device parameters.
| Original language | English |
|---|---|
| Pages | 386-389 |
| DOIs | |
| Publication status | Published - May 1999 |
| Event | SID Symposium Digest of Technical Papers - Duration: 1 May 1999 → 1 May 1999 |
Conference
| Conference | SID Symposium Digest of Technical Papers |
|---|---|
| Period | 1/05/99 → 1/05/99 |
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