Pairwise proximity-based features for test escape screening

Fan Lin, Chun Kai Hsu, Alberto Giovanni Busetto, Kwang Ting Cheng

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

4 Citations (Scopus)

Abstract

Test escapes are chips that pass the chip-level test program but fail system-level test or in the field. It is known that statistical analysis based on chip production test data could identify abnormalities for screening test escapes. It has also been shown that from the chip test data, we can generate revealing features for statistical analysis by comparing the measurement data to different references such as the measurement mean of a wafer, the spatial pattern of a wafer, and the measurements of neighboring chips. Given these existing features as the base features, this paper proposes a new class of transformations which could generate additional informative features based on pairwise proximities between chips on the same wafer. Specifically, we apply multiple distance functions in a feature space composed of the base features and calculate the corresponding pairwise proximities between each pair of chips. Each of the resulting proximities could potentially embed some unique information that reveals the abnormalities of some test escapes. Then we convert the proximities into Euclidean vector spaces using constant shift embedding (CSE), which preserves the cluster structure through the conversion, so that traditional outlier analysis algorithms such as local outlier factor (LOF) can be applied. The LOF value and the first dimension in each embedded space are used as additional features for each sample. These new features, jointly analyzed with the base features, provide more revealing information about test escapes and thus further improve the test escape detection rate in our experiment based on production test data.

Original languageEnglish
Title of host publication2015 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages300-306
Number of pages7
ISBN (Electronic)9781467383882
DOIs
Publication statusPublished - 5 Jan 2016
Externally publishedYes
Event34th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015 - Austin, United States
Duration: 2 Nov 20156 Nov 2015

Publication series

Name2015 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015

Conference

Conference34th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015
Country/TerritoryUnited States
CityAustin
Period2/11/156/11/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

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