Process design kit and design automation for flexible hybrid electronics

Tsung Ching Huang, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Sicheng Li, Zhenan Bao, Kwang Ting Cheng, Raymond Beausoleil

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

1 Citation (Scopus)

Abstract

High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE, because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution-processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and hybrid-integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications from flexible displays to wearable medical devices. Here we report: 1) process design kit (PDK) to enable FHE design automation for large-scale FHE circuits, and 2) solution-process proven intellectual property (IP) blocks for TFT circuits design, including Pseudo-CMOS [1] flexible digital logic and analog amplifiers shown in Figure 1.

Original languageEnglish
Title of host publication2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728106557
DOIs
Publication statusPublished - Apr 2019
Event2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 - Hsinchu, Taiwan, Province of China
Duration: 22 Apr 201925 Apr 2019

Publication series

Name2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

Conference

Conference2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Country/TerritoryTaiwan, Province of China
CityHsinchu
Period22/04/1925/04/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

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