Process design kit for flexible hybrid electronics

Leilai Shao; Tsung Ching Huang; Ting Lei; Zhenan Bao; Raymond Beausoleil; Kwang Ting Cheng

doi:10.1109/ASPDAC.2018.8297396

Process design kit for flexible hybrid electronics

Leilai Shao^*, Tsung Ching Huang, Ting Lei, Zhenan Bao, Raymond Beausoleil, Kwang Ting Cheng

^*Corresponding author for this work

Office of the Dean of Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

26 Citations (Scopus)

Abstract

Flexible Electronics (FE) is emerging for wearables and low-cost internet of things (IoT) nodes benefiting from its low-cost fabrication and mechanical flexibility. Combining FE with thinned silicon chips, known as flexible hybrid electronics (FHE), can take advantages of both low-cost printed electronics and high performance silicon chips. To design a FHE system, the process design kit (PDK) offering the capabilities for circuit design, simulation and verification for both FE and silicon chips is needed. The key elements of FHE-PDK include technology files for design rule checking (DRC), layout versus schematic (LVS) and layout parasitics extraction (LPE), as well as SPICE-compatible models for flexible thin-film transistors (TFTs) and passive elements. Wafer scale measurements are used to validate our SPICE models and design rules are derived accordingly to assure a satisfactory yield. With FHE-PDK, circuit and system designers can therefore focus on design innovations and can rely on design tools to produce manufacturable designs.

Original language	English
Title of host publication	ASP-DAC 2018 - 23rd Asia and South Pacific Design Automation Conference, Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	651-657
Number of pages	7
ISBN (Electronic)	9781509006021
DOIs	https://doi.org/10.1109/ASPDAC.2018.8297396
Publication status	Published - 20 Feb 2018
Event	23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018 - Jeju, Korea, Republic of Duration: 22 Jan 2018 → 25 Jan 2018

Publication series

Name	Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
Volume	2018-January

Conference

Conference	23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018
Country/Territory	Korea, Republic of
City	Jeju
Period	22/01/18 → 25/01/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/ASPDAC.2018.8297396

Cite this

Shao, L., Huang, T. C., Lei, T., Bao, Z., Beausoleil, R., & Cheng, K. T. (2018). Process design kit for flexible hybrid electronics. In ASP-DAC 2018 - 23rd Asia and South Pacific Design Automation Conference, Proceedings (pp. 651-657). (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2018.8297396

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abstract = "Flexible Electronics (FE) is emerging for wearables and low-cost internet of things (IoT) nodes benefiting from its low-cost fabrication and mechanical flexibility. Combining FE with thinned silicon chips, known as flexible hybrid electronics (FHE), can take advantages of both low-cost printed electronics and high performance silicon chips. To design a FHE system, the process design kit (PDK) offering the capabilities for circuit design, simulation and verification for both FE and silicon chips is needed. The key elements of FHE-PDK include technology files for design rule checking (DRC), layout versus schematic (LVS) and layout parasitics extraction (LPE), as well as SPICE-compatible models for flexible thin-film transistors (TFTs) and passive elements. Wafer scale measurements are used to validate our SPICE models and design rules are derived accordingly to assure a satisfactory yield. With FHE-PDK, circuit and system designers can therefore focus on design innovations and can rely on design tools to produce manufacturable designs.",

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Shao, L, Huang, TC, Lei, T, Bao, Z, Beausoleil, R & Cheng, KT 2018, Process design kit for flexible hybrid electronics. in ASP-DAC 2018 - 23rd Asia and South Pacific Design Automation Conference, Proceedings. Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 651-657, 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018, Jeju, Korea, Republic of, 22/01/18. https://doi.org/10.1109/ASPDAC.2018.8297396

Process design kit for flexible hybrid electronics. / Shao, Leilai; Huang, Tsung Ching; Lei, Ting et al.
ASP-DAC 2018 - 23rd Asia and South Pacific Design Automation Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 651-657 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC; Vol. 2018-January).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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AU - Cheng, Kwang Ting

PY - 2018/2/20

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N2 - Flexible Electronics (FE) is emerging for wearables and low-cost internet of things (IoT) nodes benefiting from its low-cost fabrication and mechanical flexibility. Combining FE with thinned silicon chips, known as flexible hybrid electronics (FHE), can take advantages of both low-cost printed electronics and high performance silicon chips. To design a FHE system, the process design kit (PDK) offering the capabilities for circuit design, simulation and verification for both FE and silicon chips is needed. The key elements of FHE-PDK include technology files for design rule checking (DRC), layout versus schematic (LVS) and layout parasitics extraction (LPE), as well as SPICE-compatible models for flexible thin-film transistors (TFTs) and passive elements. Wafer scale measurements are used to validate our SPICE models and design rules are derived accordingly to assure a satisfactory yield. With FHE-PDK, circuit and system designers can therefore focus on design innovations and can rely on design tools to produce manufacturable designs.

AB - Flexible Electronics (FE) is emerging for wearables and low-cost internet of things (IoT) nodes benefiting from its low-cost fabrication and mechanical flexibility. Combining FE with thinned silicon chips, known as flexible hybrid electronics (FHE), can take advantages of both low-cost printed electronics and high performance silicon chips. To design a FHE system, the process design kit (PDK) offering the capabilities for circuit design, simulation and verification for both FE and silicon chips is needed. The key elements of FHE-PDK include technology files for design rule checking (DRC), layout versus schematic (LVS) and layout parasitics extraction (LPE), as well as SPICE-compatible models for flexible thin-film transistors (TFTs) and passive elements. Wafer scale measurements are used to validate our SPICE models and design rules are derived accordingly to assure a satisfactory yield. With FHE-PDK, circuit and system designers can therefore focus on design innovations and can rely on design tools to produce manufacturable designs.

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Shao L, Huang TC, Lei T, Bao Z, Beausoleil R, Cheng KT. Process design kit for flexible hybrid electronics. In ASP-DAC 2018 - 23rd Asia and South Pacific Design Automation Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 651-657. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). doi: 10.1109/ASPDAC.2018.8297396

Process design kit for flexible hybrid electronics

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Bibliographical note

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