Programmable Micro-Object Assembly with Transfer

Yu Wang; Anne Plochowietz; Yunda Wang; Matthew Shreve; Lara S. Crawford; Sourobh Raychaudhuri; Sergey Butylkov; Bradley B. Rupp; Qian Wang; Jamie Kalb; Jeng P. Lu; Eugene M. Chow

doi:10.1109/TRANSDUCERS.2019.8808800

Programmable Micro-Object Assembly with Transfer

Yu Wang
, Anne Plochowietz
, Yunda Wang
, Matthew Shreve
, Lara S. Crawford
, Sourobh Raychaudhuri
, Sergey Butylkov
, Bradley B. Rupp
, Qian Wang
, Jamie Kalb
, Jeng P. Lu
, Eugene M. Chow

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

5 Citations (Scopus)

Abstract

A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.

Original language	English
Title of host publication	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	390-393
Number of pages	4
ISBN (Electronic)	9781728120072
DOIs	https://doi.org/10.1109/TRANSDUCERS.2019.8808800
Publication status	Published - Jun 2019
Externally published	Yes
Event	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany Duration: 23 Jun 2019 → 27 Jun 2019

Publication series

Name	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Country/Territory	Germany
City	Berlin
Period	23/06/19 → 27/06/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

directed electrostatic assembly
heterogeneous integration
micro-assembly printer
transfer

Access to Document

10.1109/TRANSDUCERS.2019.8808800

Cite this

Wang, Y., Plochowietz, A., Wang, Y., Shreve, M., Crawford, L. S., Raychaudhuri, S., Butylkov, S., Rupp, B. B., Wang, Q., Kalb, J., Lu, J. P., & Chow, E. M. (2019). Programmable Micro-Object Assembly with Transfer. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 390-393). Article 8808800 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2019.8808800

Wang, Yu ; Plochowietz, Anne ; Wang, Yunda et al. / Programmable Micro-Object Assembly with Transfer. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 390-393 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

@inproceedings{d762755425ba4535baa2a34f31861aed,

title = "Programmable Micro-Object Assembly with Transfer",

abstract = "A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.",

keywords = "directed electrostatic assembly, heterogeneous integration, micro-assembly printer, transfer",

author = "Yu Wang and Anne Plochowietz and Yunda Wang and Matthew Shreve and Crawford, \{Lara S.\} and Sourobh Raychaudhuri and Sergey Butylkov and Rupp, \{Bradley B.\} and Qian Wang and Jamie Kalb and Lu, \{Jeng P.\} and Chow, \{Eugene M.\}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII ; Conference date: 23-06-2019 Through 27-06-2019",

year = "2019",

month = jun,

doi = "10.1109/TRANSDUCERS.2019.8808800",

language = "English",

series = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "390--393",

booktitle = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

}

Wang, Y, Plochowietz, A, Wang, Y, Shreve, M, Crawford, LS, Raychaudhuri, S, Butylkov, S, Rupp, BB, Wang, Q, Kalb, J, Lu, JP & Chow, EM 2019, Programmable Micro-Object Assembly with Transfer. in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII., 8808800, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Institute of Electrical and Electronics Engineers Inc., pp. 390-393, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 23/06/19. https://doi.org/10.1109/TRANSDUCERS.2019.8808800

Programmable Micro-Object Assembly with Transfer. / Wang, Yu; Plochowietz, Anne; Wang, Yunda et al.
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. p. 390-393 8808800 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Programmable Micro-Object Assembly with Transfer

AU - Wang, Yu

AU - Plochowietz, Anne

AU - Wang, Yunda

AU - Shreve, Matthew

AU - Crawford, Lara S.

AU - Raychaudhuri, Sourobh

AU - Butylkov, Sergey

AU - Rupp, Bradley B.

AU - Wang, Qian

AU - Kalb, Jamie

AU - Lu, Jeng P.

AU - Chow, Eugene M.

PY - 2019/6

Y1 - 2019/6

N2 - A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.

AB - A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.

KW - directed electrostatic assembly

KW - heterogeneous integration

KW - micro-assembly printer

KW - transfer

UR - https://openalex.org/W2969675144

UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000539487000099

U2 - 10.1109/TRANSDUCERS.2019.8808800

DO - 10.1109/TRANSDUCERS.2019.8808800

M3 - Conference Paper published in a book

T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

SP - 390

EP - 393

BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Y2 - 23 June 2019 through 27 June 2019

ER -

Wang Y, Plochowietz A, Wang Y, Shreve M, Crawford LS, Raychaudhuri S et al. Programmable Micro-Object Assembly with Transfer. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc. 2019. p. 390-393. 8808800. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). doi: 10.1109/TRANSDUCERS.2019.8808800

Programmable Micro-Object Assembly with Transfer

Abstract

Publication series

Conference

Bibliographical note

UN SDGs

Keywords

Access to Document

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