Programmable Micro-Object Assembly with Transfer

Yu Wang; Anne Plochowietz; Yunda Wang; Matthew Shreve; Lara S. Crawford; Sourobh Raychaudhuri; Sergey Butylkov; Bradley B. Rupp; Qian Wang; Jamie Kalb; Jeng P. Lu; Eugene M. Chow

doi:10.1109/TRANSDUCERS.2019.8808800

Programmable Micro-Object Assembly with Transfer

Yu Wang, Anne Plochowietz, Yunda Wang, Matthew Shreve, Lara S. Crawford, Sourobh Raychaudhuri, Sergey Butylkov, Bradley B. Rupp, Qian Wang, Jamie Kalb, Jeng P. Lu, Eugene M. Chow

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

5 Citations (Scopus)

Abstract

A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.

Original language	English
Title of host publication	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	390-393
Number of pages	4
ISBN (Electronic)	9781728120072
DOIs	https://doi.org/10.1109/TRANSDUCERS.2019.8808800
Publication status	Published - Jun 2019
Externally published	Yes
Event	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany Duration: 23 Jun 2019 → 27 Jun 2019

Publication series

Name	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Country/Territory	Germany
City	Berlin
Period	23/06/19 → 27/06/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Keywords

directed electrostatic assembly
heterogeneous integration
micro-assembly printer
transfer

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/TRANSDUCERS.2019.8808800

Cite this

Wang, Y., Plochowietz, A., Wang, Y., Shreve, M., Crawford, L. S., Raychaudhuri, S., Butylkov, S., Rupp, B. B., Wang, Q., Kalb, J., Lu, J. P., & Chow, E. M. (2019). Programmable Micro-Object Assembly with Transfer. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 390-393). Article 8808800 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2019.8808800

Wang, Yu ; Plochowietz, Anne ; Wang, Yunda et al. / Programmable Micro-Object Assembly with Transfer. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 390-393 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

@inproceedings{d762755425ba4535baa2a34f31861aed,

title = "Programmable Micro-Object Assembly with Transfer",

abstract = "A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.",

keywords = "directed electrostatic assembly, heterogeneous integration, micro-assembly printer, transfer",

author = "Yu Wang and Anne Plochowietz and Yunda Wang and Matthew Shreve and Crawford, \{Lara S.\} and Sourobh Raychaudhuri and Sergey Butylkov and Rupp, \{Bradley B.\} and Qian Wang and Jamie Kalb and Lu, \{Jeng P.\} and Chow, \{Eugene M.\}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII ; Conference date: 23-06-2019 Through 27-06-2019",

year = "2019",

month = jun,

doi = "10.1109/TRANSDUCERS.2019.8808800",

language = "English",

series = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "390--393",

booktitle = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

}

Wang, Y, Plochowietz, A, Wang, Y, Shreve, M, Crawford, LS, Raychaudhuri, S, Butylkov, S, Rupp, BB, Wang, Q, Kalb, J, Lu, JP & Chow, EM 2019, Programmable Micro-Object Assembly with Transfer. in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII., 8808800, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Institute of Electrical and Electronics Engineers Inc., pp. 390-393, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 23/06/19. https://doi.org/10.1109/TRANSDUCERS.2019.8808800

Programmable Micro-Object Assembly with Transfer. / Wang, Yu; Plochowietz, Anne; Wang, Yunda et al.
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. p. 390-393 8808800 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Programmable Micro-Object Assembly with Transfer

AU - Wang, Yu

AU - Plochowietz, Anne

AU - Wang, Yunda

AU - Shreve, Matthew

AU - Crawford, Lara S.

AU - Raychaudhuri, Sourobh

AU - Butylkov, Sergey

AU - Rupp, Bradley B.

AU - Wang, Qian

AU - Kalb, Jamie

AU - Lu, Jeng P.

AU - Chow, Eugene M.

PY - 2019/6

Y1 - 2019/6

N2 - A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.

AB - A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.

KW - directed electrostatic assembly

KW - heterogeneous integration

KW - micro-assembly printer

KW - transfer

UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000539487000099

U2 - 10.1109/TRANSDUCERS.2019.8808800

DO - 10.1109/TRANSDUCERS.2019.8808800

M3 - Conference Paper published in a book

T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

SP - 390

EP - 393

BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Y2 - 23 June 2019 through 27 June 2019

ER -

Wang Y, Plochowietz A, Wang Y, Shreve M, Crawford LS, Raychaudhuri S et al. Programmable Micro-Object Assembly with Transfer. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc. 2019. p. 390-393. 8808800. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). doi: 10.1109/TRANSDUCERS.2019.8808800

Programmable Micro-Object Assembly with Transfer

Abstract

Publication series

Conference

Bibliographical note

Keywords

UN SDGs

Access to Document

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