Skip to main navigation Skip to search Skip to main content

Quasi-2D compact modeling for double-gate MOSFET

  • Mansun Chan*
  • , Tze Yin Man
  • , Jin He
  • , Xuemei Xi
  • , Chung Hsun Lin
  • , Xinnan Lin
  • , Ping K. Ko
  • , Ali M. Niknejad
  • , Chenming Hu
  • *Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

This paper presents an approach to model the characteristics of undoped Double-Gate MOSFETs without relying on the charge-sheet approximation. Due to the extremely thin silicon film used, the inversion charge thickness becomes comparable to the silicon film thickness and cannot be ignored. Together with volume inversion and quantum effect, the carriers are distributed along the vertical direction perpendicular to the direction of current flow. Therefore, a 2D modeling approach considering vertical current distribution and lateral carrier transport is required. To simplify the 2-D problem, the quasi-Fermi potential has been taken as a reference to develop a quasi 2-D DG MOSFET model.

Original languageEnglish
Title of host publication2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
PublisherNano Science and Technology Institute
Pages108-113
Number of pages6
ISBN (Print)0972842276, 9780972842273
Publication statusPublished - 2004
Event2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004 - Boston, MA, United States
Duration: 7 Mar 200411 Mar 2004

Publication series

Name2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
Volume2

Conference

Conference2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
Country/TerritoryUnited States
CityBoston, MA
Period7/03/0411/03/04

Keywords

  • BSIM
  • CMOS Device
  • Circuit Simulation
  • Device model
  • Double-gate MOSFET
  • SPICE

Fingerprint

Dive into the research topics of 'Quasi-2D compact modeling for double-gate MOSFET'. Together they form a unique fingerprint.

Cite this