Reversely-Synchronized-Stress-Induced Degradation in Polycrystalline Silicon Thin-Film Transistors and Its Suppression by a Bridged-Grain Structure

Meng Zhang, Sunbin Deng, Wei Zhou, Yan Yan*, Man Wong, Hoi Sing Kwok

*Corresponding author for this work

Research output: Contribution to journalJournal Articlepeer-review

7 Citations (Scopus)

Abstract

In this letter, a reversely synchronized stress (RSS) is proposed to simulate the working condition of switching thin-film transistors (TFTs) in active-matrix displays. The reliability of polycrystalline silicon (poly-Si) TFTs under RSS is characterized and investigated. RSS brings huge device degradation. A dynamic hot carrier (HC) effect, dependent on transition edges of RSS, dominates the degradation. Combined with a transient simulation, the degradation mechanism under RSS in poly-Si TFTs is discussed and developed. To suppress RSS-induced HC degradation, a bridged-grain (BG) structure is employed in the active layer of poly-Si TFTs. Via BG lines' reducing the lateral electric field in the channel at source/drain sides, the reliability of BG TFTs under RSS is significantly improved.

Original languageEnglish
Article number9125948
Pages (from-to)1213-1216
Number of pages4
JournalIEEE Electron Device Letters
Volume41
Issue number8
DOIs
Publication statusPublished - Aug 2020

Bibliographical note

Publisher Copyright:
© 1980-2012 IEEE.

Keywords

  • Reversely synchronized stress
  • bridged grain
  • dynamic hot carrier
  • polycrystalline silicon
  • thin-film transistors

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