Robustify ML-based lithography hotspot detectors

Jingyu Pan, Chen Chia Chang, Zhiyao Xie, Jiang Hu, Yiran Chen

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

Deep learning has been widely applied in various VLSI design automation tasks, from layout quality estimation to design optimization. Though deep learning has shown state-of-the-art performance in several applications, recent studies reveal that deep neural networks exhibit intrinsic vulnerability to adversarial perturbations, which pose risks in the ML-aided VLSI design flow. One of the most effective strategies to improve robustness is regularization approaches, which adjust the optimization objective to make the deep neural network generalize better. In this paper, we examine several adversarial defense methods to improve the robustness of ML-based lithography hotspot detectors. We present an innovative design rule checking (DRC)-guided curvature regularization (CURE) approach, which is customized to robustify ML-based lithography hotspot detectors against white-box attacks. Our approach allows for improvements in both the robustness and the accuracy of the model. Experiments show that the model optimized by DRC-guided CURE achieves the highest robustness and accuracy compared with those trained using the baseline defense methods. Compared with the vanilla model, DRC-guided CURE decreases the average attack success rate by 53.9% and increases the average ROC-AUC by 12.1%. Compared with the best of the defense baselines, DRC-guided CURE reduces the average attack success rate by 18.6% and improves the average ROC-AUC by 4.3%.

Original languageEnglish
Title of host publicationProceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450392174
DOIs
Publication statusPublished - 30 Oct 2022
Event41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022 - San Diego, United States
Duration: 30 Oct 20224 Nov 2022

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Conference

Conference41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022
Country/TerritoryUnited States
CitySan Diego
Period30/10/224/11/22

Bibliographical note

Publisher Copyright:
© 2022 Association for Computing Machinery.

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