Sealed Silicon Cavities (SSC) Equips Piezoelectric Micromachined Ultrasonic Transducer Arrays with an Ultra-High Fill Factor of 95.5%

Jiashuai Xu*, Xiaoya Duan, Yufeng Gao, Xinyue Zhang, Junyan Zheng, Zijun Ren, Zhichen Yan, Kai Yang, Chengjie Zuo, Yipeng Lu, Yansong Yang

*Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

This work presents, for the first time, a 95.5% ultra-high fill factor sealed silicon cavity- piezoelectric micromachined ultrasonic transducer (SSC-PMUT) array. A 31×26 array is designed, fabricated, and characterized. By leveraging silicon migration technology optimized for PMUT arrays, the element spacing has been reduced to 1.4 μm. The fabricated array has an electromechanical coupling coefficient of 2.4% at 5.8 MHz and an air-coupled displacement sensitivity of 33.2 nm/V. The 31×26 array exhibits a transmission sensitivity of 4.1 kPa/V at 6.25 mm, featuring a symmetrical radiation pattern and a main lobe width of 19°. Directivity measurements show that the ultra-high fill factor enables the SSC-PMUT array to have a wider main lobe width and lower side lobe levels with a smaller array size. Experimental results demonstrate that the 95.5% fill factor SSC-PMUT array could be a promising platform for wide-angle and high-resolution ultrasound sensing/imaging applications.

Original languageEnglish
Title of host publication2025 IEEE International Ultrasonics Symposium, IUS 2025
PublisherIEEE Computer Society
ISBN (Electronic)9798331523329
ISBN (Print)9798331523336
DOIs
Publication statusPublished - 20 Oct 2025
Event2025 IEEE International Ultrasonics Symposium, IUS 2025 - Utrecht, Netherlands
Duration: 15 Sept 202518 Sept 2025

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2025 IEEE International Ultrasonics Symposium, IUS 2025
Country/TerritoryNetherlands
CityUtrecht
Period15/09/2518/09/25

Bibliographical note

Publisher Copyright:
© 2025 IEEE.

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