@inproceedings{44d261e02f5148ee8548aeb829617041,
title = "Soft-lithography-based high temperature molding method to fabricate whole teflon microfluidic chips",
abstract = "In this work, we present a high-temperature (up to 350 °C) thermal molding method using PDMS master to fabricate microstructures (e.g., high-aspect-ratio and 3D) in Teflon with high resolution and fidelity at down to sub-micron scale. In addition, we demonstrate a convenient strategy for bonding Teflon plates and can easily fabricate whole Teflon microfluidic chips, which are extremely chemical-inert, anti-fouling and biocompatible.",
keywords = "Chemical-resistant microfluidic chip, PDMS, Soft-lithography, Teflon PFA",
author = "Ren, \{K. N.\} and Zheng, \{Y. Z.\} and W. Dai and D. Ryan and Fung, \{C. Y.\} and Wu, \{H. K.\}",
year = "2010",
language = "English",
isbn = "9781618390622",
series = "14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010",
pages = "554--556",
booktitle = "14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010",
note = "14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010 ; Conference date: 03-10-2010 Through 07-10-2010",
}