Soft-lithography-based high temperature molding method to fabricate whole teflon microfluidic chips

K. N. Ren, Y. Z. Zheng, W. Dai, D. Ryan, C. Y. Fung, H. K. Wu*

*Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

9 Citations (Scopus)

Abstract

In this work, we present a high-temperature (up to 350 °C) thermal molding method using PDMS master to fabricate microstructures (e.g., high-aspect-ratio and 3D) in Teflon with high resolution and fidelity at down to sub-micron scale. In addition, we demonstrate a convenient strategy for bonding Teflon plates and can easily fabricate whole Teflon microfluidic chips, which are extremely chemical-inert, anti-fouling and biocompatible.

Original languageEnglish
Title of host publication14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010
Pages554-556
Number of pages3
Publication statusPublished - 2010
Event14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010 - Groningen, Netherlands
Duration: 3 Oct 20107 Oct 2010

Publication series

Name14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010
Volume1

Conference

Conference14th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2010, MicroTAS 2010
Country/TerritoryNetherlands
CityGroningen
Period3/10/107/10/10

Keywords

  • Chemical-resistant microfluidic chip
  • PDMS
  • Soft-lithography
  • Teflon PFA

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