Spatial pattern analysis of process variations in silicon microring modulators

Rui Wu; Chin Hui Chen; Tsung Ching Huang; Ray Beausoleil; Kwang Ting Cheng

doi:10.1109/OIC.2016.7482978

Spatial pattern analysis of process variations in silicon microring modulators

Rui Wu^*, Chin Hui Chen, Tsung Ching Huang, Ray Beausoleil, Kwang Ting Cheng

^*Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

6 Citations (Scopus)

Abstract

We identified significant spatial patterns in the wafer-scale process variation data of silicon microring modulators. These spatial patterns implicate some variation sources in certain fabrication process steps.

Original language	English
Title of host publication	5th IEEE Photonics Society Optical Interconnects Conference, OI 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	116-117
Number of pages	2
ISBN (Electronic)	9781509018741
DOIs	https://doi.org/10.1109/OIC.2016.7482978
Publication status	Published - 1 Jun 2016
Externally published	Yes
Event	5th IEEE Photonics Society Optical Interconnects Conference, OI 2016 - San Diego, United States Duration: 9 May 2016 → 11 May 2016

Publication series

Name	5th IEEE Photonics Society Optical Interconnects Conference, OI 2016

Conference

Conference	5th IEEE Photonics Society Optical Interconnects Conference, OI 2016
Country/Territory	United States
City	San Diego
Period	9/05/16 → 11/05/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Keywords

Process variation
microring modulator
silicon photonics

Access to Document

10.1109/OIC.2016.7482978

Cite this

Wu, R., Chen, C. H., Huang, T. C., Beausoleil, R., & Cheng, K. T. (2016). Spatial pattern analysis of process variations in silicon microring modulators. In 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016 (pp. 116-117). Article 7482978 (5th IEEE Photonics Society Optical Interconnects Conference, OI 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OIC.2016.7482978

@inproceedings{5c3d1d3331004b71bc0c94bfdd38234d,

title = "Spatial pattern analysis of process variations in silicon microring modulators",

abstract = "We identified significant spatial patterns in the wafer-scale process variation data of silicon microring modulators. These spatial patterns implicate some variation sources in certain fabrication process steps.",

keywords = "Process variation, microring modulator, silicon photonics",

author = "Rui Wu and Chen, \{Chin Hui\} and Huang, \{Tsung Ching\} and Ray Beausoleil and Cheng, \{Kwang Ting\}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016 ; Conference date: 09-05-2016 Through 11-05-2016",

year = "2016",

month = jun,

day = "1",

doi = "10.1109/OIC.2016.7482978",

language = "English",

series = "5th IEEE Photonics Society Optical Interconnects Conference, OI 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "116--117",

booktitle = "5th IEEE Photonics Society Optical Interconnects Conference, OI 2016",

}

Wu, R, Chen, CH, Huang, TC, Beausoleil, R & Cheng, KT 2016, Spatial pattern analysis of process variations in silicon microring modulators. in 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016., 7482978, 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016, Institute of Electrical and Electronics Engineers Inc., pp. 116-117, 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016, San Diego, United States, 9/05/16. https://doi.org/10.1109/OIC.2016.7482978

Spatial pattern analysis of process variations in silicon microring modulators. / Wu, Rui; Chen, Chin Hui; Huang, Tsung Ching et al.
5th IEEE Photonics Society Optical Interconnects Conference, OI 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 116-117 7482978 (5th IEEE Photonics Society Optical Interconnects Conference, OI 2016).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Spatial pattern analysis of process variations in silicon microring modulators

AU - Wu, Rui

AU - Chen, Chin Hui

AU - Huang, Tsung Ching

AU - Beausoleil, Ray

AU - Cheng, Kwang Ting

PY - 2016/6/1

Y1 - 2016/6/1

N2 - We identified significant spatial patterns in the wafer-scale process variation data of silicon microring modulators. These spatial patterns implicate some variation sources in certain fabrication process steps.

AB - We identified significant spatial patterns in the wafer-scale process variation data of silicon microring modulators. These spatial patterns implicate some variation sources in certain fabrication process steps.

KW - Process variation

KW - microring modulator

KW - silicon photonics

UR - https://openalex.org/W2418334293

UR - https://www.scopus.com/pages/publications/84978511651

U2 - 10.1109/OIC.2016.7482978

DO - 10.1109/OIC.2016.7482978

M3 - Conference Paper published in a book

T3 - 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016

SP - 116

EP - 117

BT - 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016

Y2 - 9 May 2016 through 11 May 2016

ER -

Wu R, Chen CH, Huang TC, Beausoleil R, Cheng KT. Spatial pattern analysis of process variations in silicon microring modulators. In 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 116-117. 7482978. (5th IEEE Photonics Society Optical Interconnects Conference, OI 2016). doi: 10.1109/OIC.2016.7482978

Spatial pattern analysis of process variations in silicon microring modulators

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

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