TY - GEN
T1 - Study of interfacial moisture diffusion at Cu/epoxy interface by FTIR-MIR technique
AU - Chan, Edward K.L.
AU - Yuen, Matthew M.F.
PY - 2007
Y1 - 2007
N2 - The delamination at the copper lead frame and the epoxy interface adversely affects the reliability of IC packages and this is a common failure mode during the qualification process. One of the factors governing the interfacial delamination is the moisture content at the interface. This study further developed the experimental measurement of interfacial moisture diffusion by Fourier Transform Infrared Spectroscopy - multiple internal reflection (FTIR-MIR) with new calibration method. In this study, interfacial moisture detection was conducted on isothermal gloptop epoxy system at different positions of sample with constant humidity level 85% relative humidity at 85 degree Celsius by FTIR-MIR. By comparing the FTIR results on the epoxy samples with different pre-conditioning time, the interfacial moisture content at different position in epoxy sample was obtained and comparison was made. Mechanism of interfacial moisture diffusion was then characterized. This study has demonstrated the seepage mechanism along the copper/epoxy is the major driver for interfacial delamination under moisture pre-condition. It is likely that is the prevailing mechanism as compared to the established bulk diffusion mechanism in the epoxy molding compound.
AB - The delamination at the copper lead frame and the epoxy interface adversely affects the reliability of IC packages and this is a common failure mode during the qualification process. One of the factors governing the interfacial delamination is the moisture content at the interface. This study further developed the experimental measurement of interfacial moisture diffusion by Fourier Transform Infrared Spectroscopy - multiple internal reflection (FTIR-MIR) with new calibration method. In this study, interfacial moisture detection was conducted on isothermal gloptop epoxy system at different positions of sample with constant humidity level 85% relative humidity at 85 degree Celsius by FTIR-MIR. By comparing the FTIR results on the epoxy samples with different pre-conditioning time, the interfacial moisture content at different position in epoxy sample was obtained and comparison was made. Mechanism of interfacial moisture diffusion was then characterized. This study has demonstrated the seepage mechanism along the copper/epoxy is the major driver for interfacial delamination under moisture pre-condition. It is likely that is the prevailing mechanism as compared to the established bulk diffusion mechanism in the epoxy molding compound.
UR - https://www.scopus.com/pages/publications/35348821132
U2 - 10.1109/ECTC.2007.374038
DO - 10.1109/ECTC.2007.374038
M3 - Conference Paper published in a book
AN - SCOPUS:35348821132
SN - 1424409853
SN - 9781424409853
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1782
EP - 1787
BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07
Y2 - 29 May 2007 through 1 June 2007
ER -