Study on contour shaping in wire micro-grinding

In order to realize the micro-machining on local area of wires, a new grinding method was proposed. Through the force condition analysis of the deflected wires, the jacking force formula was deduced. The pressure distribution in contact area and cutting depth distribution of the grains were modeled respectively. Based on the relationship between the grinding positions and the jacking forces, a deflection adjusting method was proposed to realize the grinding processes of step wires and taper wires. In a self-assembled grinding platform, machine visual was taken as measurement method, fixed-position grinding and sweeping grinding experiments were conducted. The results of fixed-position grinding show that the wire profile in grinding area is parabolic after grinding. Shape evolution of wires suggests that the pressure distribution on contact area is parabolic initially and tends to be uniformed as the grinding goes on. The wire deflection has a critical impact on the material removal rate and the shape of the parabola. The results of the sweeping grinding show that step and taper wires may be obtained with different deflection adjusting parameters.