Study on Light Emitting Surface Temperature of LEDs

Fanny Zhao; Guoshuai Dong; Guoming Yang; Yapei Zeng; Brian Shieh; S. W. Ricky Lee

doi:10.1109/ICEPT50128.2020.9202667

Study on Light Emitting Surface Temperature of LEDs

Fanny Zhao, Guoshuai Dong, Guoming Yang, Yapei Zeng, Brian Shieh, S. W. Ricky Lee

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

4 Citations (Scopus)

Abstract

Infrared (IR) and thermocouple (TC) measurements of the light emission surface of white, blue, red and green LEDs are demonstrated using Transient Thermal Tester (T3Ster). It is shown that the IR measurement could obtain a more accurate result which is lower than the junction temperature (Tj) of LED. However, the TC measurement led to a higher temperature than Tj due to the heating effect resulted from the radiation of LED. IR measurement of the light emitting surface temperature of LEDs with dispensing and remote phosphor driven by the pulsed current is analyzed to show the transient temperature response on light emission surface with correlation between the peak light emitting surface temperature and the pulse current and width.

Original language	English
Title of host publication	2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728168265
DOIs	https://doi.org/10.1109/ICEPT50128.2020.9202667
Publication status	Published - Aug 2020
Event	21st International Conference on Electronic Packaging Technology, ICEPT 2020 - Guangzhou, China Duration: 12 Aug 2020 → 15 Aug 2020

Publication series

Name	2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020

Conference

Conference	21st International Conference on Electronic Packaging Technology, ICEPT 2020
Country/Territory	China
City	Guangzhou
Period	12/08/20 → 15/08/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

Infrared
LED
encapsulant
junction temperature
phosphor
pulsed
thermocouple

Access to Document

10.1109/ICEPT50128.2020.9202667

Cite this

Zhao, F., Dong, G., Yang, G., Zeng, Y., Shieh, B., & Ricky Lee, S. W. (2020). Study on Light Emitting Surface Temperature of LEDs. In 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020 Article 9202667 (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT50128.2020.9202667

@inproceedings{460eb55134474a7a8939d04631f7d5bc,

title = "Study on Light Emitting Surface Temperature of LEDs",

abstract = "Infrared (IR) and thermocouple (TC) measurements of the light emission surface of white, blue, red and green LEDs are demonstrated using Transient Thermal Tester (T3Ster). It is shown that the IR measurement could obtain a more accurate result which is lower than the junction temperature (Tj) of LED. However, the TC measurement led to a higher temperature than Tj due to the heating effect resulted from the radiation of LED. IR measurement of the light emitting surface temperature of LEDs with dispensing and remote phosphor driven by the pulsed current is analyzed to show the transient temperature response on light emission surface with correlation between the peak light emitting surface temperature and the pulse current and width.",

keywords = "Infrared, LED, encapsulant, junction temperature, phosphor, pulsed, thermocouple",

author = "Fanny Zhao and Guoshuai Dong and Guoming Yang and Yapei Zeng and Brian Shieh and \{Ricky Lee\}, \{S. W.\}",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 21st International Conference on Electronic Packaging Technology, ICEPT 2020 ; Conference date: 12-08-2020 Through 15-08-2020",

year = "2020",

month = aug,

doi = "10.1109/ICEPT50128.2020.9202667",

language = "English",

series = "2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020",

}

Zhao, F, Dong, G, Yang, G, Zeng, Y, Shieh, B & Ricky Lee, SW 2020, Study on Light Emitting Surface Temperature of LEDs. in 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020., 9202667, 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020, Institute of Electrical and Electronics Engineers Inc., 21st International Conference on Electronic Packaging Technology, ICEPT 2020, Guangzhou, China, 12/08/20. https://doi.org/10.1109/ICEPT50128.2020.9202667

Study on Light Emitting Surface Temperature of LEDs. / Zhao, Fanny; Dong, Guoshuai; Yang, Guoming et al.
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9202667 (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Study on Light Emitting Surface Temperature of LEDs

AU - Zhao, Fanny

AU - Dong, Guoshuai

AU - Yang, Guoming

AU - Zeng, Yapei

AU - Shieh, Brian

AU - Ricky Lee, S. W.

PY - 2020/8

Y1 - 2020/8

N2 - Infrared (IR) and thermocouple (TC) measurements of the light emission surface of white, blue, red and green LEDs are demonstrated using Transient Thermal Tester (T3Ster). It is shown that the IR measurement could obtain a more accurate result which is lower than the junction temperature (Tj) of LED. However, the TC measurement led to a higher temperature than Tj due to the heating effect resulted from the radiation of LED. IR measurement of the light emitting surface temperature of LEDs with dispensing and remote phosphor driven by the pulsed current is analyzed to show the transient temperature response on light emission surface with correlation between the peak light emitting surface temperature and the pulse current and width.

AB - Infrared (IR) and thermocouple (TC) measurements of the light emission surface of white, blue, red and green LEDs are demonstrated using Transient Thermal Tester (T3Ster). It is shown that the IR measurement could obtain a more accurate result which is lower than the junction temperature (Tj) of LED. However, the TC measurement led to a higher temperature than Tj due to the heating effect resulted from the radiation of LED. IR measurement of the light emitting surface temperature of LEDs with dispensing and remote phosphor driven by the pulsed current is analyzed to show the transient temperature response on light emission surface with correlation between the peak light emitting surface temperature and the pulse current and width.

KW - Infrared

KW - LED

KW - encapsulant

KW - junction temperature

KW - phosphor

KW - pulsed

KW - thermocouple

UR - https://openalex.org/W3088053734

UR - https://www.scopus.com/pages/publications/85093365352

U2 - 10.1109/ICEPT50128.2020.9202667

DO - 10.1109/ICEPT50128.2020.9202667

M3 - Conference Paper published in a book

T3 - 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020

BT - 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 21st International Conference on Electronic Packaging Technology, ICEPT 2020

Y2 - 12 August 2020 through 15 August 2020

ER -

Zhao F, Dong G, Yang G, Zeng Y, Shieh B, Ricky Lee SW. Study on Light Emitting Surface Temperature of LEDs. In 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9202667. (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020). doi: 10.1109/ICEPT50128.2020.9202667

Study on Light Emitting Surface Temperature of LEDs

Abstract

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Bibliographical note

Keywords

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