Surface eigenstress and size-dependent ultimate tensile strength of thin films

Tong Yi Zhang*

*Corresponding author for this work

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

A general continuum framework based on the surface eigenstress model is developed to predict the size-dependent ultimate tensile strength of thin films, which gives analytic equations in terms of intrinsic surface and bulk material properties. First-principles calculations and molecular dynamics (MD) simulations were conducted on Au and Si (100) thin films, showing that the ultimate tensile strengths of the Au and Si (100) thin films increase and decrease with the reduction of the film thickness, respectively, indicating correspondingly the smaller the stronger and the smaller the weaker behaviors. Both behaviors were perfectly predicted by a nonlinear scaling law developed from the surface eigenstress model.

Original languageEnglish
Pages1097-1098
Number of pages2
Publication statusPublished - 2017
Externally publishedYes
Event14th International Conference on Fracture, ICF 2017 - Rhodes, Greece
Duration: 18 Jun 201720 Jun 2017

Conference

Conference14th International Conference on Fracture, ICF 2017
Country/TerritoryGreece
CityRhodes
Period18/06/1720/06/17

Bibliographical note

Publisher Copyright:
© 2017 Chinese Society of Theoretical and Applied Mechanics. All Rights Reserved.

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