TY - JOUR
T1 - Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method
AU - Lau, John H.
AU - Lee, S. W.Ricky
PY - 2000/3/1
Y1 - 2000/3/1
N2 - The popcorning effect of plastic ball grid array (PBGA) packages is analyzed using the method of fracture mechanics. The following three specific problems are studied: (1) crack initiation in the die attach of the package, (2) crack growth in the die attach, and (3) crack growth at the interface between the solder mask and copper. Two different methods (crack tip opening displacement and virtual crack closure technique) are used to determine the crack-tip parameters such as the strain energy release rate, stress intensity factors, and phase angle for different crack lengths and temperatures.
AB - The popcorning effect of plastic ball grid array (PBGA) packages is analyzed using the method of fracture mechanics. The following three specific problems are studied: (1) crack initiation in the die attach of the package, (2) crack growth in the die attach, and (3) crack growth at the interface between the solder mask and copper. Two different methods (crack tip opening displacement and virtual crack closure technique) are used to determine the crack-tip parameters such as the strain energy release rate, stress intensity factors, and phase angle for different crack lengths and temperatures.
UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000167107600007
UR - https://openalex.org/W2039593481
UR - https://www.scopus.com/pages/publications/0002981320
U2 - 10.1115/1.483129
DO - 10.1115/1.483129
M3 - Journal Article
SN - 1043-7398
VL - 122
SP - 34
EP - 41
JO - Journal of Electronic Packaging, Transactions of the ASME
JF - Journal of Electronic Packaging, Transactions of the ASME
IS - 1
ER -