Thermal performance of LED packages for solid state lighting with novel cooling solutions

Kai Zhang; David G.W. Xiao; Xiaohua Zhang; Haibo Fan; Zhaoli Gao; Matthew M.F. Yuen

doi:10.1109/ESIME.2011.5765839

Thermal performance of LED packages for solid state lighting with novel cooling solutions

Kai Zhang^*, David G.W. Xiao, Xiaohua Zhang, Haibo Fan, Zhaoli Gao, Matthew M.F. Yuen

^*Corresponding author for this work

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

11 Citations (Scopus)

Abstract

With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.

Original language	English
Title of host publication	2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
DOIs	https://doi.org/10.1109/ESIME.2011.5765839
Publication status	Published - 2011
Event	2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011

Publication series

Name	2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Conference

Conference	2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
Country/Territory	Austria
City	Linz
Period	18/04/11 → 20/04/11

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10.1109/ESIME.2011.5765839

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Zhang, K., Xiao, D. G. W., Zhang, X., Fan, H., Gao, Z., & Yuen, M. M. F. (2011). Thermal performance of LED packages for solid state lighting with novel cooling solutions. In 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 Article 5765839 (2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011). https://doi.org/10.1109/ESIME.2011.5765839

Zhang, Kai ; Xiao, David G.W. ; Zhang, Xiaohua et al. / Thermal performance of LED packages for solid state lighting with novel cooling solutions. 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 2011. (2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011).

@inproceedings{586aa694e3744363bd2bd736e4207223,

title = "Thermal performance of LED packages for solid state lighting with novel cooling solutions",

abstract = "With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.",

author = "Kai Zhang and Xiao, \{David G.W.\} and Xiaohua Zhang and Haibo Fan and Zhaoli Gao and Yuen, \{Matthew M.F.\}",

year = "2011",

doi = "10.1109/ESIME.2011.5765839",

language = "English",

isbn = "9781457701078",

series = "2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011",

booktitle = "2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011",

note = "2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 ; Conference date: 18-04-2011 Through 20-04-2011",

}

Zhang, K, Xiao, DGW, Zhang, X, Fan, H, Gao, Z & Yuen, MMF 2011, Thermal performance of LED packages for solid state lighting with novel cooling solutions. in 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011., 5765839, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, Linz, Austria, 18/04/11. https://doi.org/10.1109/ESIME.2011.5765839

Thermal performance of LED packages for solid state lighting with novel cooling solutions. / Zhang, Kai; Xiao, David G.W.; Zhang, Xiaohua et al.
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 2011. 5765839 (2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Thermal performance of LED packages for solid state lighting with novel cooling solutions

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AU - Xiao, David G.W.

AU - Zhang, Xiaohua

AU - Fan, Haibo

AU - Gao, Zhaoli

AU - Yuen, Matthew M.F.

PY - 2011

Y1 - 2011

N2 - With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.

AB - With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.

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DO - 10.1109/ESIME.2011.5765839

M3 - Conference Paper published in a book

AN - SCOPUS:79957918338

SN - 9781457701078

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BT - 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

T2 - 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Y2 - 18 April 2011 through 20 April 2011

ER -

Zhang K, Xiao DGW, Zhang X, Fan H, Gao Z, Yuen MMF. Thermal performance of LED packages for solid state lighting with novel cooling solutions. In 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 2011. 5765839. (2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011). doi: 10.1109/ESIME.2011.5765839

Thermal performance of LED packages for solid state lighting with novel cooling solutions

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