Thermal Transport across Atomically Sharp SiC/Si Interfaces

Qinqin He; Yanguang Zhou

Thermal Transport across Atomically Sharp SiC/Si Interfaces

Qinqin He
, Yanguang Zhou^*

^*Corresponding author for this work

Department of Mechanical and Aerospace Engineering

Research output: Contribution to conference › Conference Paper › peer-review

Original language	English
Publication status	Published - May 2024
Event	The 27th Annual Conference of HKSTAM 2024, The 19th Jiangsu – Hong Kong Forum on Mechanics and Its Application - Duration: 1 May 2024 → 1 May 2024

Conference

Conference	The 27th Annual Conference of HKSTAM 2024, The 19th Jiangsu – Hong Kong Forum on Mechanics and Its Application
Period	1/05/24 → 1/05/24

Access to Document

https://hdl.handle.net/1783.1/147706

Cite this

@conference{44a41e03efe44805b79fd97613c4d4c1,

title = "Thermal Transport across Atomically Sharp SiC/Si Interfaces",

author = "Qinqin He and Yanguang Zhou",

year = "2024",

month = may,

language = "English",

note = "The 27th Annual Conference of HKSTAM 2024, The 19th Jiangsu – Hong Kong Forum on Mechanics and Its Application ; Conference date: 01-05-2024 Through 01-05-2024",

}