Vertical β-GaO Power Transistors: A Review

Man Hoi Wong*, Masataka Higashiwaki*

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

164 Citations (Scopus)

Abstract

With projected performance advantages over silicon and incumbent wide-bandgap compound semiconductors, gallium oxide (Ga2O3) has garnered worldwide attention as an ultrawide-bandgap semiconductor material suitable for high-voltage, high-temperature, and radiation-hard electronics. Thanks to recent breakthroughs in crystal growth and device processing technologies, the research and development of vertically oriented Ga2O3 power transistors has made rapid strides. In this article, we review the important engineering achievements and performance milestones of the two major types of vertical Ga2O3 transistors - current aperture vertical metal-oxide-semiconductor field-effect transistors (MOSFETs) and vertical fin-channel MOSFETs. Challenges underlying the unique processing approaches to these devices and their implications on device reliability are also discussed.

Original languageEnglish
Article number9198897
Pages (from-to)3925-3937
Number of pages13
JournalIEEE Transactions on Electron Devices
Volume67
Issue number10
DOIs
Publication statusPublished - Oct 2020
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 1963-2012 IEEE.

Keywords

  • Breakdown
  • FinFET
  • Ga₂O₃
  • current aperture
  • current blocking layer (CBL)
  • depletion mode (D-mode)
  • drain-induced barrier lowering (DIBL)
  • enhancement mode (E-mode)
  • gallium oxide
  • halide vapor phase epitaxy (HVPE)
  • interface trap
  • ion implantation
  • power transistor
  • vertical metal-oxide-semiconductor field-effect transistor (MOSFET)
  • wide bandgap

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